MR

Martin Reiss

Infineon Technologies Ag: 4 patents #64 of 1,152Top 6%
📍 Sinzing, DE: #2 of 10 inventorsTop 20%
Overall (2005): #10,752 of 245,428Top 5%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6949820 Substrate-based chip package Alfred Haimerl, Steffen Kroehnert 2005-09-27
6933595 Electronic device and leadframe and methods for producing the electronic device and the leadframe Jürgen Zacherl 2005-08-23
6906928 Electronic component with a semiconductor chip, and method of producing the electronic component Christian Hauser 2005-06-14
6873060 Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components Stephan Blaszczak 2005-03-29