Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6956287 | Electronic component with flexible bonding pads and method of producing such a component | Harry Hedler | 2005-10-18 |
| 6949820 | Substrate-based chip package | Martin Reiss, Steffen Kroehnert | 2005-09-27 |
| 6914328 | Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers | — | 2005-07-05 |
| 6897568 | Electronic component with flexible contacting pads and method for producing the electronic component | Harry Hedler, Jens Pohl | 2005-05-24 |