HH

Holger Hubner

Infineon Technologies Ag: 4 patents #64 of 1,152Top 6%
📍 Baldham, DE: #1 of 5 inventorsTop 20%
Overall (2005): #12,217 of 245,428Top 5%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6930383 Electronic component including a housing and a substrate Hans-Jurgen Hacke, Axel Königer, Max Seitz, Rainer Tilgner 2005-08-16
6915945 Method for contact-connecting an electrical component to a substrate having a conductor structure 2005-07-12
6906370 Semiconductor component having a material reinforced contact area Thomas Rohr 2005-06-14
6872464 Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent Vaidyanathan Kripesh 2005-03-29