Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872464 | Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent | Holger Hubner | 2005-03-29 |
| 6846725 | Wafer-level package for micro-electro-mechanical systems | Ranganathan Nagarajan, Chirayarikathuveedu Sankarapillai Premachandran, Yu-Chiao Chen | 2005-01-25 |