Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919642 | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed | Yu-Te HSIEH, Shyh-Ming Chang | 2005-07-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919642 | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed | Yu-Te HSIEH, Shyh-Ming Chang | 2005-07-19 |