Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972490 | Bonding structure with compliant bumps | Yuan-Chang Huang, Wen-Chih Chen, Sheng-Shu Yang | 2005-12-06 |
| 6919642 | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed | Yu-Te HSIEH, Wen-Ti Lin | 2005-07-19 |