Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977213 | IC chip solder bump structure and method of manufacturing same | Yu-Ying Tsai, Kuo-Wei Lin | 2005-12-20 |
| 6916702 | Gate process and gate structure for an embedded memory device | Hsiao-Ying Yang | 2005-07-12 |