Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977213 | IC chip solder bump structure and method of manufacturing same | Shih-Ming Chen, Kuo-Wei Lin | 2005-12-20 |
YT
Yu-Ying Tsai
Overall (2005): #67,925 of 245,428Top 30%
1
Patents 2005