Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6892925 | Solder hierarchy for lead free solder joint | Mario J. Interrante, Mukta G. Farooq | 2005-05-17 |
| 6854636 | Structure and method for lead free solder electronic package interconnections | Mukta G. Farooq, Mario J. Interrante | 2005-02-15 |