MI

Mario J. Interrante

IBM: 3 patents #481 of 5,214Top 10%
📍 New Paltz, NY: #2 of 18 inventorsTop 15%
🗺 New York: #598 of 8,003 inventorsTop 8%
Overall (2005): #20,143 of 245,428Top 9%
3
Patents 2005

Issued Patents 2005

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6917113 Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly Mukta G. Farooq 2005-07-12
6892925 Solder hierarchy for lead free solder joint Mukta G. Farooq, William E. Sablinski 2005-05-17
6854636 Structure and method for lead free solder electronic package interconnections Mukta G. Farooq, William E. Sablinski 2005-02-15