Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6924171 | Bilayer wafer-level underfill | Stephen L. Buchwalter, David Danovitch, Fuad E. Doany, Claudius Feger, Revathi Iyengar +1 more | 2005-08-02 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components | Minkailu A Jalloh, Chon Cheong Lei | 2005-06-28 |