Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6965171 | Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules | Tim H. Lee, Donald J. Papae, Francis F. Szenher | 2005-11-15 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components | Peter A. Gruber, Minkailu A Jalloh | 2005-06-28 |