Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909179 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Shigeki Tanaka, Atsushi Fujisawa, Souichi Nagano, Tsugihiko Hirano, Ryouichi Oota +2 more | 2005-06-21 |
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2005-05-03 |