SO

Shingo Ohsaka

HS Hitachi Hokkai Semiconductor: 1 patents #4 of 22Top 20%
RT Renesas Technology: 1 patents #364 of 1,110Top 35%
📍 Hakodate, JP: #2 of 4 inventorsTop 50%
Overall (2005): #102,041 of 245,428Top 45%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6887739 Method of manufacturing semiconductor package including forming a resin sealing member Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani 2005-05-03