Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6869822 | Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening | Tomohisa Yagi, Nobuhiro Imaizumi, Kenji Fukuzono | 2005-03-22 |
YU
Yasuhiro Usui
Overall (2005): #72,884 of 245,428Top 30%
1
Patents 2005