Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6873056 | Electrode-to-electrode bond structure | Seiki Sakuyama, Tomohisa Yagi | 2005-03-29 |
| 6869822 | Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening | Tomohisa Yagi, Yasuhiro Usui, Kenji Fukuzono | 2005-03-22 |