Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6933614 | Integrated circuit die having a copper contact and method therefor | Chu-Chung Lee, Fuaida Harun, Lan Chu Tan, Cheng Choi Yong | 2005-08-23 |
| 6921979 | Semiconductor device having a bond pad and method therefor | Susan H. Downey, Peter R. Harper, Michael V. Leoni, Tu-Anh N. Tran | 2005-07-26 |