Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967145 | Method of maintaining photolithographic precision alignment after wafer bonding process | Chung-Yang Tseng, Reuy-shing Huang, Tong-An Lee, Kuo-Chung Chan, Hung-Dar Wang | 2005-11-22 |
| 6864176 | Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method | Hung-Dar Wang, Ruey-Shing Huang, Chung-Yang Tseng | 2005-03-08 |
| 6838303 | Silicon pressure sensor and the manufacturing method thereof | Hung-Dar Wang | 2005-01-04 |