Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967145 | Method of maintaining photolithographic precision alignment after wafer bonding process | Shih-Chin Gong, Reuy-shing Huang, Tong-An Lee, Kuo-Chung Chan, Hung-Dar Wang | 2005-11-22 |
| 6864176 | Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method | Hung-Dar Wang, Ruey-Shing Huang, Shih-Chin Gong | 2005-03-08 |