Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893901 | Carrier with metal bumps for semiconductor die packages | — | 2005-05-17 |
| 6861286 | Method for making power chip scale package | Maria Cristina Estacio | 2005-03-01 |
| 6857459 | Wirefilm bonding for electronic component interconnection | — | 2005-02-22 |