Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6870254 | Flip clip attach and copper clip attach on MOSFET device | Maria Clemens Y. Quinones | 2005-03-22 |
| 6867489 | Semiconductor die package processable at the wafer level | — | 2005-03-15 |
| 6861286 | Method for making power chip scale package | Ruben Madrid | 2005-03-01 |