Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967395 | Mounting for a package containing a chip | Steven Webster, Roy Dale Hollaway | 2005-11-22 |
| 6962829 | Method of making near chip size integrated circuit package | Roy Dale Hollaway, Anthony E. Panczak | 2005-11-08 |
| 6946316 | Method of fabricating and using an image sensor package | Steven Webster | 2005-09-20 |
| 6943429 | Wafer having alignment marks extending from a first to a second surface of the wafer | Roy Dale Hollaway, Steven Webster | 2005-09-13 |
| 6893900 | Method of making an integrated circuit package | — | 2005-05-17 |
| 6875379 | Tool and method for forming an integrated optical circuit | Steven Webster | 2005-04-05 |
| 6869861 | Back-side wafer singulation method | Roy Dale Hollaway, Steven Webster | 2005-03-22 |
| 6849916 | Flip chip on glass sensor package | Steven Webster, Roy Dale Hollaway | 2005-02-01 |