Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967395 | Mounting for a package containing a chip | Thomas P. Glenn, Steven Webster | 2005-11-22 |
| 6962829 | Method of making near chip size integrated circuit package | Thomas P. Glenn, Anthony E. Panczak | 2005-11-08 |
| 6943429 | Wafer having alignment marks extending from a first to a second surface of the wafer | Thomas P. Glenn, Steven Webster | 2005-09-13 |
| 6869861 | Back-side wafer singulation method | Thomas P. Glenn, Steven Webster | 2005-03-22 |
| 6849916 | Flip chip on glass sensor package | Thomas P. Glenn, Steven Webster | 2005-02-01 |