Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6885086 | Reduced copper lead frame for saw-singulated chip package | Harry J. Fogelson, Gregorio G. Dela Cruz, Primitivo A. Palasi, William M. Anderson, Ahmer Syed | 2005-04-26 |
| 6847099 | Offset etched corner leads for semiconductor package | Gregorio G. Dela Cruz, Fidelyn R. Canoy, Leocadio Morona Alabin | 2005-01-25 |
| 6841414 | Saw and etch singulation method for a chip package | Tom Hu, Terry Davis, Won Dai Shin | 2005-01-11 |