Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6885086 | Reduced copper lead frame for saw-singulated chip package | Harry J. Fogelson, Ludovico E. Bancod, Primitivo A. Palasi, William M. Anderson, Ahmer Syed | 2005-04-26 |
| 6847099 | Offset etched corner leads for semiconductor package | Ludovico E. Bancod, Fidelyn R. Canoy, Leocadio Morona Alabin | 2005-01-25 |