Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875694 | Method of treating inlaid copper for improved capping layer adhesion without damaging porous low-k materials | Minh Van Ngo, Hieu Pham | 2005-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875694 | Method of treating inlaid copper for improved capping layer adhesion without damaging porous low-k materials | Minh Van Ngo, Hieu Pham | 2005-04-05 |