Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946324 | Process for fabricating a leadless plastic chip carrier | Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2005-09-20 |
| 6940154 | Integrated circuit package and method of manufacturing the integrated circuit package | Serafin P. Pedron, Jr., Lin Yee | 2005-09-06 |
| 6933176 | Ball grid array package and process for manufacturing same | Mohan Kirloskar, Chun Ho Fan | 2005-08-23 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2005-08-23 |
| 6903304 | Process for dressing molded array package saw blade | Chun Ho Fan, Geraldine Tsui Yee Lin, John Ping Sheung Lau | 2005-06-07 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan | 2005-03-29 |
| 6841859 | Premolded cavity IC package | Labeeb Sadak Thamby, Hugo Chi Wai Wong, William Lap Keung Chow | 2005-01-11 |