Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979594 | Process for manufacturing ball grid array package | Sadak Thamby Labeeb, Ming Wang Sze | 2005-12-27 |
| 6964918 | Electronic components such as thin array plastic packages and process for fabricating same | Kwok Cheung Tsang | 2005-11-15 |
| 6946324 | Process for fabricating a leadless plastic chip carrier | Neil McLellan, Kin Pui Kwan, Wing Him Lau | 2005-09-20 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2005-08-23 |
| 6933176 | Ball grid array package and process for manufacturing same | Mohan Kirloskar, Neil McLellan | 2005-08-23 |
| 6903304 | Process for dressing molded array package saw blade | Neil McLellan, Geraldine Tsui Yee Lin, John Ping Sheung Lau | 2005-06-07 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Neil McLellan | 2005-03-29 |