Issued Patents 2004
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808643 | Hybrid interconnect substrate and method of manufacture thereof | Moriss Kung | 2004-10-26 |
| 6779783 | Method and structure for tape ball grid array package | Chen-Yueh Kung, Jackie Fu | 2004-08-24 |
| 6743659 | Method for manufacturing multi-layer package substrates | Moriss Kung | 2004-06-01 |
| 6724081 | Electronic assembly | Kung Moriss, Lin-Chou Tung | 2004-04-20 |
| 6716037 | Flexible electric-contact structure for IC package | Moriss Kung | 2004-04-06 |
| 6717264 | High density integrated circuit package | Moriss Kung | 2004-04-06 |
| 6711025 | Combination device of the IC connection device and the main board | Kung Moriss | 2004-03-23 |
| 6707162 | Chip package structure | Moriss Kung | 2004-03-16 |
| 6699046 | Pin grid array integrated circuit connecting device | Kung Moriss, Lin-Chou Tung | 2004-03-02 |
| 6695040 | Thin planar heat distributor | Moriss Kung | 2004-02-24 |
| 6696305 | Metal post manufacturing method | Moriss Kung | 2004-02-24 |
| 6692265 | Electrical connection device | Moriss Kung | 2004-02-17 |