Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808643 | Hybrid interconnect substrate and method of manufacture thereof | Kwun-Yao Ho | 2004-10-26 |
| 6743659 | Method for manufacturing multi-layer package substrates | Kwun-Yao Ho | 2004-06-01 |
| 6716037 | Flexible electric-contact structure for IC package | Kwun-Yao Ho | 2004-04-06 |
| 6716692 | Fabrication process and structure of laminated capacitor | Kwun-Yo Ho | 2004-04-06 |
| 6717264 | High density integrated circuit package | Kwun-Yao Ho | 2004-04-06 |
| 6707162 | Chip package structure | Kwun-Yao Ho | 2004-03-16 |
| 6696305 | Metal post manufacturing method | Kwun-Yao Ho | 2004-02-24 |
| 6695040 | Thin planar heat distributor | Kwun-Yao Ho | 2004-02-24 |
| 6692265 | Electrical connection device | Kwun-Yao Ho | 2004-02-17 |