JF

Jackie Fu

VT Via Technologies: 1 patents #34 of 123Top 30%
📍 Baoshan, TW: #83 of 342 inventorsTop 25%
Overall (2004): #201,632 of 270,089Top 75%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6779783 Method and structure for tape ball grid array package Chen-Yueh Kung, Kwun-Yao Ho 2004-08-24