Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Keiji Maeda, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Keiji Maeda, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |