Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Michio Osada, Keiji Maeda, Yoshihisa Kawamoto, Yoshiji Shimizu, Susumu Yamahara | 2004-08-10 |
| 6737378 | Silicon nitride sintered products and processes for their production | Naoto Hirosaki, Yoshinobu Yamamoto, Mamoru Mitomo | 2004-05-18 |