Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773247 | Die used for resin-sealing and molding an electronic component | Keiji Maeda, Yoshihisa Kawamoto, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara | 2004-08-10 |
| 6736703 | Cutting apparatus and cutting method | Masataka Takehara, Makoto Matsuo | 2004-05-18 |
| 6712674 | Polishing apparatus and polishing method | Makoto Matsuo, Masataka Takehara | 2004-03-30 |