Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835595 | Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package | Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba +2 more | 2004-12-28 |
| 6830956 | Method for packaging a low profile semiconductor device | Kenji Masumoto | 2004-12-14 |
| 6780749 | Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges | Kenji Masumoto, Akira Karashima | 2004-08-24 |
| 6774496 | Semiconductor package with a thermoset bond | Kiyoshi Yajima, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae | 2004-08-10 |
| 6759745 | Semiconductor device and manufacturing method thereof | Kenji Masumoto | 2004-07-06 |
| 6734532 | Back side coating of semiconductor wafers | Sreenivasan K. Koduri, Kenji Masumoto | 2004-05-11 |
| 6716674 | Method of forming a semiconductor package | Kiyoshi Yajima, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae | 2004-04-06 |