Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774496 | Semiconductor package with a thermoset bond | Kiyoshi Yajima, Mutsumi Masumoto, Kimitaka Nishio, Noriyuki Kirikae | 2004-08-10 |
| 6716674 | Method of forming a semiconductor package | Kiyoshi Yajima, Mutsumi Masumoto, Kimitaka Nishio, Noriyuki Kirikae | 2004-04-06 |