Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780749 | Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges | Kenji Masumoto, Mutsumi Masumoto | 2004-08-24 |
| 6768212 | Semiconductor packages and methods for manufacturing such semiconductor packages | Margaret Simmons-Matthews, Sohichi Kadoguchi | 2004-07-27 |