Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790777 | Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device | Glenn J. Tessmer, Mercer Brugler, Sarah Hartwig | 2004-09-14 |
| 6686283 | Shallow trench isolation planarization using self aligned isotropic etch | Shawn T. Walsh, John E. Campbell, Somit Joshi, James B. Friedmann, Michael J. McGranaghan +8 more | 2004-02-03 |