Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790777 | Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device | Glenn J. Tessmer, Ju-Ai Ruan, Mercer Brugler | 2004-09-14 |