Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6826827 | Forming conductive posts by selective removal of conductive material | — | 2004-12-07 |
| 6821821 | Methods for manufacturing resistors using a sacrificial layer | — | 2004-11-23 |
| 6821815 | Method of assembling a semiconductor chip package | John W. Smith | 2004-11-23 |
| 6809608 | Transmission line structure with an air dielectric | — | 2004-10-26 |
| 6780747 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 2004-08-24 |
| 6774317 | Connection components with posts | — | 2004-08-10 |
| 6737265 | Microelectronic unit forming methods and materials | Masud Beroz, Belgacem Haba, Christopher M. Pickett, John W. Smith | 2004-05-18 |
| 6709899 | Methods of making microelectronic assemblies having conductive elastomeric posts | — | 2004-03-23 |
| 6706973 | Electrical connection with inwardly deformable contacts | Thomas H. DiStefano | 2004-03-16 |
| 6700072 | Electrical connection with inwardly deformable contacts | Thomas H. DiStefano | 2004-03-02 |
| 6690186 | Methods and structures for electronic probing arrays | — | 2004-02-10 |