Issued Patents 2004
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828668 | Flexible lead structures and methods of making same | John W. Smith | 2004-12-07 |
| 6822320 | Microelectronic connection components utilizing conductive cores and polymeric coatings | — | 2004-11-23 |
| 6820330 | Method for forming a multi-layer circuit assembly | — | 2004-11-23 |
| 6800537 | Methods of making anisotropic conductive elements for use in microelectronic packaging | — | 2004-10-05 |
| 6763579 | Method of making components with releasable leads | Konstantine Karavakis | 2004-07-20 |
| 6765800 | Multiple channel modules and bus systems using same | Richard E. Perego, David Nguyen, Billy Wayne Garrett, Jr., Ely Tsern, Craig E. Hampel +1 more | 2004-07-20 |
| 6758984 | Selective removal of dielectric materials and plating process using same | Irina Poukhova, Masud Beroz | 2004-07-06 |
| 6750539 | Joining semiconductor units with bonding material | Klaus Wolter | 2004-06-15 |
| 6737265 | Microelectronic unit forming methods and materials | Masud Beroz, Joseph Fjelstad, Christopher M. Pickett, John W. Smith | 2004-05-18 |
| 6721189 | Memory module | — | 2004-04-13 |
| 6720643 | Stacked semiconductor module | Thomas F. Fox, Sayeh Khalili, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2004-04-13 |
| 6699730 | Stacked microelectronic assembly and method therefor | Young Seo Kim, Vernon Solberg | 2004-03-02 |
| 6675469 | Vapor phase connection techniques | John W. Smith | 2004-01-13 |
| 6674161 | Semiconductor stacked die devices | — | 2004-01-06 |