Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780747 | Methods for providing void-free layers for semiconductor assemblies | Joseph Fjelstad | 2004-08-24 |
| 6723584 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, John W. Smith | 2004-04-20 |
| 6709895 | Packaged microelectronic elements with enhanced thermal conduction | — | 2004-03-23 |
| 6706973 | Electrical connection with inwardly deformable contacts | Joseph Fjelstad | 2004-03-16 |
| 6700072 | Electrical connection with inwardly deformable contacts | Joseph Fjelstad | 2004-03-02 |
| 6687842 | Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element | John W. Smith | 2004-02-03 |