Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833042 | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board | Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Shinji Nakamura | 2004-12-21 |
| 6820331 | Method of manufacturing a circuit board and its manufacturing apparatus | Kunio Kishimoto, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura | 2004-11-23 |
| 6814836 | Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material | Shigeru Yamane, Shinji Nakamura, Masayuki Sakai | 2004-11-09 |
| 6700071 | Multi-layer circuit board having at least two or more circuit patterns connected | Toshiaki Takenaka, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto | 2004-03-02 |
| 6698093 | Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board | — | 2004-03-02 |
| 6686029 | Circuit board and method for manufacturing the same | Takeshi Suzuki, Satoru Tomekawa, Fumio Echigo | 2004-02-03 |
| 6671951 | Printed wiring board, and method and apparatus for manufacturing the same | Shigeru Yamane, Shinji Nakamura, Hidenori Hayashi, Toru Fujimoto, Toshiharu Okada +1 more | 2004-01-06 |