Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833042 | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board | Shigeru Yamane, Eiji Kawamoto, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura | 2004-12-21 |
| 6700071 | Multi-layer circuit board having at least two or more circuit patterns connected | Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Kunio Kishimoto | 2004-03-02 |