Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833042 | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board | Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura | 2004-12-21 |
| 6814836 | Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material | Toshihiro Nishii, Shinji Nakamura, Masayuki Sakai | 2004-11-09 |
| 6700071 | Multi-layer circuit board having at least two or more circuit patterns connected | Toshiaki Takenaka, Toshihiro Nishii, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto | 2004-03-02 |
| 6671951 | Printed wiring board, and method and apparatus for manufacturing the same | Toshihiro Nishii, Shinji Nakamura, Hidenori Hayashi, Toru Fujimoto, Toshiharu Okada +1 more | 2004-01-06 |