Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2004-09-07 |