Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830989 | Method and apparatus for handling arrayed part | Satoshi Shida, Takashi Shimizu, Kenji Takahashi, Ryoji Inutsuka, Hiroyuki Yoshida | 2004-12-14 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Takaharu Mae | 2004-09-07 |
| 6706130 | Method and device for frictional connection and holding tool used for the frictional connection device | Shozo Minamitani, Satoshi Shida, Yasuharu Ueno | 2004-03-16 |
| 6692214 | Pusher, puller loader, unloader, and working device | Satoshi Shida, Takashi Shimizu, Ryoji Inutsuka, Hiroaki Hayashi, Yuichi Takakura | 2004-02-17 |