Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2004-09-07 |