Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836401 | Capacitor, laminated capacitor, and capacitor built-in-board | Tsunenori Yoshida, Mikinari Shimada, Hiroyuki Handa, Masaaki Kuranuki, Akihiro Ishikawa | 2004-12-28 |
| 6818979 | High-frequency semiconductor device | Hideki Takehara, Noriyuki Yoshikawa, Kunihiko Kanazawa | 2004-11-16 |
| 6815810 | High-frequency semiconductor device | Hideki Takehara, Noriyuki Yoshikawa, Kunihiko Kanazawa | 2004-11-09 |
| 6798121 | Module with built-in electronic elements and method of manufacture thereof | Yoshihiro Bessho, Yasuhiro Sugaya, Keiji Onishi | 2004-09-28 |
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Koichi Hirano, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita, Hiroyuki Ishitomi | 2004-09-07 |
| 6784530 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Satoru Yuhaku +1 more | 2004-08-31 |
| 6734542 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu | 2004-05-11 |
| 6707671 | Power module and method of manufacturing the same | Yoshihisa Yamashita, Koichi Hirano | 2004-03-16 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Koichi Hirano, Mitsuhiro Matsuo | 2004-03-02 |
| 6692818 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Koichi Hirano, Yoshihisa Yamashita | 2004-02-17 |