Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Hiroyuki Ishitomi | 2004-09-07 |
| 6707671 | Power module and method of manufacturing the same | Koichi Hirano, Seiichi Nakatani | 2004-03-16 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2004-03-02 |
| 6692818 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Koichi Hirano, Seiichi Nakatani | 2004-02-17 |